High Thermal Conductivity Thermal pads for the Nintendo GameCube motherboard. Cut to size.

These pads have significantly improved Thermal Conductivity over the originals. The originals are said to have a 6.0W/mk thermal conductivity where as these new pads have a thermal conductivity of 21W/mk+! 

You will receive a thermal pad for the CPU, GPU and 2 pads for each of the SRAM chips.

Installation is easy:
1. Disassemble the GameCube, 
2. Remove the drive assembly,
3. Carefully unscrew the heatsink and remove it
4. Remove the existing thermal pads and clean the surfaces of both the chips and the heatsink.
5. Remove the blue plastic backing and place the pad on the correct chips.
6. Remove the top clear plastic layer.
7. Replace the Heatsink and reassemble the rest of the console.